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   Products
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Hermetic Seal
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Since our inception, our Hermetic Sealing has been our flagship
division. The explosive innovations in communication technology has
compelled supporting technologies to develop accordingly. Only the most
progressive companies were able to comply and keep up with this demand. We
have met this challenge and have developed a wide line of hermetically
sealed packages and window caps for the most demanding applications. We
offer both Glass-Seal and Ceramic-Seal technologies.
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Ceramic
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 From simple ceramic chip carriers to intricate multi-layer co-fired
ceramics, Mackin Technologies has the in-house capability to manufacture
ceramic products for the most demanding applications. This division supplies
both internal and external customers with highly reliable ceramic
components. Our ceramic facility can accommodate to short lead-time and
small quantity needs, perfect for R&D projects. Most of our standard designs
can easily by customized by modifying existing tools and fixtures.
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Plating
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Precision plating of electronic components require very stringent
specifications and reliability. Through the years of research and
development, we have created our own specialized procedures to meet these
requirements. While developing these techniques we have also established a
highly precise continuous plating process which has set new standards in
plating, especially in the automotive applications. Our process is best
known for it's "Whiskerless" solder plating.
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Precision Machining & Stamping
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A complete vertical integration in our manufacturing process is
assured by our internal capabilities of precision machining. Our years of
experience in supplying both internal and external companies allows us to
stay responsive and enables us to offer the shortest feasible lead time.
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Photo Etching
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Aside from playing an important role as a supplier of components to our
own internal assembly, our
Photo Etching
(PE) process is one of the
major suppliers in the industry for PE processed lead frames. To enhance
our capabilities, we have also incorporated
Lamination Process,
LTCC (Low
Temperature Co-fired Ceramic) process and other Surface Treatment
technologies to our line of vertically integrated manufacturing. This
department is part of our sister company
Hirai Seimitsu Kogyo.
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Microwave Components & Instruments
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Mackin Technologies is working together with
Tamagawa Electronics Co., LTD (TME) by marketing their products in the Americas. TME designs and
manufactures Attenuators, Amplifiers, Duplexers, Filters and other RF
related products used in the infrastructure equipment for wireless
communications and broadcasting.
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