Hermetic Seal

     Since our incepetion, our Hermetic Sealing has been our               flagship division. The explosive innovations in communication      technology has compelled supporting technologies to develop      accordingly. Only the most progressive companies were able to      comply and keep up with this demand. We have met this               challenge and have developed a wide line of hermetically sealed      packages and window caps for the most demanding applications. We offer both Glass-Seal and Ceramic-Seal technologies.

Ceramic

      From simple ceramic chip carriers to intricate multi-l ayer               co-fired ceramics, Mackin Technologies has the in-house                capability to manufacture ceramic products for the most                demanding applications. This division supplies both internal and       external customers with highly reliable ceramic components.       Our ceramic facility can accommodate to short lead-time and       small quantity needs, perfect for R&D projects. Most of our standard designs can easily by customized by modifying existing tools and fixtures

Plating

     Precision plating of electronic components require very stringent      specifications and reliability. Through the years of research and      development, we have created our own specialized procedures      to meet these requirements. While developing these techniques      we have also established a highly precise continuous plating      process which has set new standards in plating, especially in the      automotive applications. Our process is best known for it's "Whiskerless" solder plating

Precision Machining & Stamping

     A complete vertical integration in our manufacturing process is               assured by our internal capabilities of precision machining. Our years      of experience in supplying both internal and external companies               allows us to stay responsive and enables us to offer the shortest      feasible lead time.

Photo Etching

     Aside from playing an important role as a supplier of               components to our own internal assembly, our Photo Etching      (PE) process is one of the major suppliers in the industry for PE      processed lead frames. To enhance our capabilities, we have      also incorporated Lamination Process, LTCC (Low                        Temperature Co-fired Ceramic) process and other Surface      Treatment technologies to our line of vertically integrated manufacturing. This department is part of our sister company Hirai Seimitsu Kogyo

Microwave Components & Instruments

     Mackin Technologies is working together with Tamagawa      Electronics Co., LTD (TME) by marketing their products in the      Americas. TME designs and manufactures Attenuators,      Amplifiers, Duplexers, Filters and other RF related products used      in the infrastructure equipment for wireless communications and      broadcasting.